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AlN Powder Aluminium Nitride Powder CAS 24304-00-5
  • AlN Powder Aluminium Nitride Powder CAS 24304-00-5
  • AlN Powder Aluminium Nitride Powder CAS 24304-00-5
  • AlN Powder Aluminium Nitride Powder CAS 24304-00-5

AlN Powder Aluminium Nitride Powder CAS 24304-00-5

Product Name: Aluminium Nitride Powder
CAS number: 24304-00-5
Molecular formula: AlN
Appearance: white powder
Purity:99.9%
Particle size:nano,micro and as customers' request
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AlN Powder Aluminium Nitride Powder CAS 24304-00-5 introduce:

Technical Parameter of AlN Powder Aluminium Nitride Powder CAS 24304-00-5:

Aluminum Nitride ceramic powder is a kind of ceramic material with high heat transfer coefficient, good electrical insulating performance. Our Aluminum nitride powder has high purity, small particle size, uniform distribution, specific surface area, high surface activity, low apparent density, good dispersion performance and injection molding, can be used in composite material, matching with the semiconductor silicon and good interfacial compatibility, can improve the mechanical properties and dielectric properties of thermal conductivity of the composite material.


Technical Parameter of AlN Powder Aluminium Nitride Powder CAS 24304-00-5:


Aluminum Nitride Powder(AlN) Certificate of Analysis-%
NOCFeSiCaCi
>33<0.5<0.04<0.01<0.045<0.009<0.0004



Application of AlN Powder Aluminium Nitride Powder CAS 24304-00-5:

1, used for high thermal conductivity filler of thermal conductivity paste and thermal conductivity silicone grease;
2, used for thermal conductive adhesive, thermally conductive silicone sheet, epoxy resin thermal conductive filling sealant with high thermal conductivity;
3, high thermal conductivity filler for thermal engineering plastics;
4, used for packaging materials, high-temperature lubricant, binder, heat dissipation paint, heat dissipation ink of high thermal conductivity filler;
5, used for the insulation and heat conduction packing of integrated circuit subgrade board (MCPCB, FCCL) with high heat conduction;
6, used high thermal conductivity filler for thermal interface material (TIM);
7, used for crucible metal smelting, evaporator, ceramic tools, cutting tools, microwave dielectric materials;
8, used for the manufacture of high heat conduction aluminum nitride ceramic substrate and various ceramic products;
9, used for conductive ceramic evaporator;
10, used for the synthesis of high quality LED phosphors


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