High Quality Aluminum Nitride High Heat Dissipation Ceramic Plates

Overview of  Aluminum Nitride High Heat Dissipation Ceramic Plates

Aluminum nitride high heat dissipation ceramic plate is a new type of material with excellent performance. With aluminum nitride as the main component, it has high thermal conductivity, which can quickly dissipate heat and effectively solve the heat dissipation problem. At the same time, aluminum nitride high heat dissipation ceramic plate also has high strength, high hardness, good insulation and chemical stability, etc., in the electronics, aerospace and other fields are widely used in the manufacture of high-performance chip packages, high-power devices, such as heat dissipation substrate.

Features of  Aluminum Nitride High Heat Dissipation Ceramic Plates

Aluminum nitride high heat dissipation ceramic plate has significant performance advantages. It has a far higher thermal conductivity than ordinary ceramic materials, with thermal conductivity up to 170 – 320W / (m-K); this excellent heat dissipation ability can quickly and evenly disperse heat and effectively solve the high-power chips, 5G base stations and other high-heat electronic equipment heat dissipation problems, to protect the stable operation of the equipment.

At the same time, aluminum nitride high heat dissipation ceramic plate has excellent electrical insulation properties, insulation resistance of up to 10 ^ 14 Ω – cm or more, and can effectively avoid circuit short circuits, leakage and other safety hazards to ensure the safe operation of electronic devices.

In terms of physical properties, aluminum nitride has high heat dissipation ceramic plate mechanical strength, hardness comparable to sapphire, compressive strength of more than 300MPa, and can withstand high mechanical stress; chemical stability and thermal stability are also excellent in acid, and alkali environments are not easy to be corroded, can be -200 ℃ to 800 ℃ extreme temperature range to maintain the performance of the stable, both high temperature, wear-resistant features, significantly extend the equipment’s It is also characterized by high-temperature resistance and abrasion resistance, which greatly extends the service life of the equipment, and can play a stable role in the harsh fields of aerospace and new energy automobiles.

Specifications table of  Aluminum Nitride High Heat Dissipation Ceramic Plates

Property	Typical Specification
Material Composition	AlN (Aluminum Nitride)
Thermal Conductivity	170 – 220 W/(m·K)
Coefficient of Thermal Expansion	~4.5 – 5.0 ppm/°C (similar to silicon)
Dielectric Strength	>20 kV/mm
Dielectric Constant (1 MHz)	~8.4 – 9.6
Volume Resistivity	>10¹⁴ Ω·cm at 25 °C
Mechanical Strength (Bending)	~350 – 450 MPa
Hardness (Vickers)	~12 – 14 GPa
Density	~3.26 g/cm³
Porosity	<1%
Operating Temperature Range	-269 °C to +1000 °C
Chemical Stability	Excellent resistance to acids, alkalis, and molten metals
Surface Finish	Can be polished to optical quality or left with a machined finish
Dimensions	Customizable; typical thickness ranges from 0.5 mm to several millimeters, with various length and width options
Purity	High purity options available (e.g., >99%)

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Applications of  Aluminum Nitride High Heat Dissipation Ceramic Plates

Aluminum nitride high heat dissipation ceramic plates play an irreplaceable role in many critical fields due to their excellent heat dissipation and physicochemical properties.

In the field of electronics and information, with the rapid development of 5G technology and artificial intelligence, chip integration is getting higher and higher, and heat generation has increased sharply. Aluminum nitride high heat dissipation ceramic plate is widely used in the manufacture of advanced chip packaging shells and heat dissipation substrate, which can not only quickly export the heat generated by the chip but also effectively isolate the electromagnetic interference to protect the stability and reliability of the chip in high-frequency, high-speed operation, and significantly improve the computing speed and service life of smartphones, servers and other electronic equipment.

 In the field of power electronics, new energy generation, smart grid and other industries, the power device performance requirements continue to rise. Aluminum nitride high heat dissipation ceramic plate for insulated gate bipolar transistor (IGBT) module and other key components of the heat dissipation structure, able to withstand high voltage, high current operating conditions generated by a large amount of heat, significantly improve the energy conversion efficiency, reduce energy loss, for new energy vehicles, fast charging, high-efficiency drive, as well as wind power generation, photovoltaic power generation system, provide a solid guarantee for the stable operation of the system.

The field of optical communication is developing in the direction of ultra-high speed and large capacity, and the heat dissipation requirements for optical modules are extremely stringent. Aluminum nitride high heat dissipation ceramic plate is used in optical modules and other core equipment, by virtue of its excellent thermal conductivity and good insulation, to ensure that the equipment in the tens or even hundreds of gigabits per second data transmission process maintains good heat dissipation, to maintain stable performance, to achieve efficient and stable optical signal transmission, is to build a high-speed optical communication network is an important basic material.

 In addition, in the field of aerospace, aircraft electronic systems face extreme temperatures, severe vibration and other complex environments; aluminum nitride high heat dissipation ceramic plate can provide reliable heat dissipation solutions for avionics to ensure the stable operation of navigation, communication and other key systems.

In the field of automotive electronics, especially the battery management system of new energy vehicles, motor controllers and other components, aluminum nitride high heat dissipation ceramic plates help solve the heat dissipation problems due to high power operation to enhance the reliability and safety of automotive electronic systems, and to promote the development of new energy automotive industry.

Company Profile

RBOSCHCO is a trusted global chemical material supplier & manufacturer with over 12 years of experience in providing super high-quality chemicals and Nanomaterials. The company exports to many countries, such as the USA, Canada, Europe, UAE, South Africa, Tanzania, Kenya, Egypt, Nigeria, Cameroon, Uganda, Turkey, Mexico, Azerbaijan, Belgium, Cyprus, Czech Republic, Brazil, Chile, Argentina, Dubai, Japan, Korea, Vietnam, Thailand, Malaysia, Indonesia, Australia, Germany, France, Italy, Portugal etc. As a leading nanotechnology development manufacturer, RBOSCHCO dominates the market. Our professional work team provides perfect solutions to help improve the efficiency of various industries, create value, and easily cope with various challenges. If you are interested, please send an email to sales1@rboschco.com

Payment Term

T/T, Western Union, Paypal, Credit Card etc.

Shipment Term

By air, by sea, by express, as customers request.

5 FAQs of  Aluminum Nitride High Heat Dissipation Ceramic Plates

Q1: Why not just use copper or aluminum?

Copper / Aluminum has high thermal conductivity but poor insulation, and the coefficient of thermal expansion does not match the chip, which can lead to thermal stress failure. Aluminum nitride has the advantages of high thermal conductivity, insulation and thermal matching, which is especially suitable for high-frequency and high-power scenarios.

Q2: What is the future development direction of aluminum nitride ceramics?

High thermal conductivity: Target to break through 200W/(m・K) or more, narrowing the gap with Japan.

Ultra-thin and integrated: R&D of 0.15mm flexible substrate to meet the demand for miniaturization of consumer electronics.

Environmental protection and sustainability: Compliance with RoHS and REACH standards and reduction of ammonia emissions in the production process.

Intelligent production: AI simulation of sintering curve to optimize energy consumption, digital twin factory to improve yield to 76%.

Q3: Is there any risk of substitution technology for Aluminum Nitride high-heat dissipation ceramic boards?

Third-generation semiconductors (e.g., Gallium Nitride) may drive heat dissipation material upgrades, but Aluminum Nitride still has advantages in terms of thermal compatibility and cost. In addition, the U.S. may include it in the technology embargo list, and need to pay attention to the progress of domestic substitution.

Q4: How to choose the right aluminum nitride ceramic plate?

Parameters need to be selected according to application scenarios:

Thermal conductivity: high power devices (such as IGBT) preferred ≥ 170W/(m・K).

Thickness: Consumer electronics choose an ultra-thin substrate below 0.2mm, and industrial equipment chooses a 0.5-1mm thick plate.

Metallization process: Thick-film copper plating is suitable for low-cost needs, and thin-film sputtering (Ti/Pt/Au) supports high-density wiring.

Q5: What should I pay attention to when installing Aluminum Nitride high-heat dissipation ceramic boards?

Thermal interface materials: Use high thermal conductive silicone grease or solder (e.g., AuSn) to reduce contact thermal resistance.

Mechanical fixing: Avoid stress concentration; use elastic shims or bolts for pre-tensioning.

Environmental protection: Surface moisture-proof treatment is required to prevent hydrolysis in humid environments.

Through the above Q&A, you can have a comprehensive understanding of the core characteristics, application scenarios and industry dynamics of aluminum nitride high heat dissipation ceramic plate, which will provide a reference for technical selection and purchasing decisions.