High quality customizable aluminum nitride isostatic ceramics

Overview of Aluminum Nitride Isostatic Ceramics

Aluminum nitride isostatic pressure ceramics is a high-performance ceramic material prepared by isostatic pressure molding process using aluminum nitride (AlN) as the main raw material. It has the advantages of high hardness, high strength, high thermal conductivity, low coefficient of expansion, good chemical stability, electrical insulation, etc. It has a wide range of applications in electronics, aerospace, machinery manufacturing and other fields, and can be used to manufacture IC substrates, ceramic cutting tools, and high-temperature resistant parts.

Features of Aluminum Nitride Isostatic Ceramics

Aluminum nitride isostatic ceramic is an advanced material with excellent performance. It has outstandingly high thermal conductivity, values up to 170 – 320W/(m-K), can be like a highly efficient heat dissipation “small hand”, quickly the heat generated by the operation of electronic equipment, greatly enhancing the operational efficiency and service life of electronic equipment, and effectively solve the thermal management of electronic equipment problems;

Aluminum nitride isostatic pressure ceramic insulation performance is also excellent; its low dielectric constant and dielectric loss are small, which can prevent circuit short circuits and leakage for the stable operation of electronic devices to build a solid safety line of defense.

At the same time, the hardness of aluminum nitride isostatic ceramics is comparable to diamond, has strength beyond most metal materials, and has excellent wear resistance in the high-speed friction environment is not easy to wear.

Moreover, with good chemical stability and corrosion resistance, aluminum nitride isostatic ceramics can maintain stable performance even in harsh chemical environments such as acid and alkali, and with a coefficient of thermal expansion similar to that of silicon, they can comfortably cope with drastic changes in temperature, avoiding stress damage due to thermal expansion and contraction, and remaining reliable under extreme working conditions.

Specifications table of Aluminum Nitride Isostatic Ceramics

Property	Typical Value
Chemical Composition	AlN ≥ 95% (purity can be adjusted according to specific requirements)
Density	3.26 – 3.30 g/cm³
Thermal Conductivity	170 – 320 W/(m·K)
Electrical Resistivity	≥ 10¹³ Ω·cm
Dielectric Constant (at 1 MHz)	8.8 – 9.5
Dielectric Loss Tangent (at 1 MHz)	≤ 0.001
Flexural Strength	300 – 500 MPa
Hardness (HV)	1200 – 1500
Thermal Expansion Coefficient	4.5 – 5.5 × 10⁻⁶ /K (in the range of 20 – 1000 °C)

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Applications of Aluminum Nitride Isostatic Ceramics

Aluminum nitride isostatic ceramics, by virtue of its excellent performance in a number of cutting-edge fields sh, ow an irreplaceable role.

In the field of electronic information, aluminum nitride isostatic pressure ceramics are not only used in the manufacture of integrated circuits substrate, with ultra-high thermal conductivity to quickly channel a large amount of heat generated by the chip operation, to avoid performance degradation or damage due to overheating but also made of ceramic packaging shell, with excellent electrical insulation to isolate the external electromagnetic interference, to ensure the stable operation of the electronic components and the accurate transmission of signals, in the 5G base stations, high-performance servers and other high-end It plays a key role in high-end equipment such as 5G base stations and high-performance servers.

 In the aerospace field, in the face of extremely complex high-altitude environments, engine parts made of aluminum nitride isostatic ceramic can withstand the harsh conditions of high temperature and high pressure and effectively enhance the thermal efficiency and reliability of the engine; radome uses its good dielectric properties and thermal stability to ensure the efficient transmission of radar signals and accurate detection and help the aircraft fly safely in the complex meteorological and electromagnetic environment.

 In the field of energy, aluminum nitride isostatic ceramics excel in high-temperature fuel cells. As a support material, it can maintain structural stability at high temperatures, providing reliable physical support for the battery; when used as an electrolyte diaphragm, it can effectively separate fuel and oxidizer by virtue of its excellent chemical stability, and, at the same time promote ionic conduction, enhance the power generation efficiency and service life of the fuel cell, and play an important role in the development and utilization of hydrogen energy.

 In the field of machinery manufacturing, aluminum nitride isostatic ceramic made of precision cutting tools, with high hardness and wear resistance, can achieve high-efficiency cutting of high-hardness metal materials, significantly improve the machining accuracy and surface quality; wear-resistant parts in heavy machinery, mining equipment, even if long-term in the high-intensity friction and impact environment, but also to maintain good performance, significantly extend the service life of the equipment, reduce maintenance costs.

 In addition, in the optical field, its good optical transparency makes it can be used to manufacture optical windows, suitable for high temperatures, strong corrosion and other special environments under the optical instruments; in the medical field, aluminum nitride isostatic ceramics good biocompatibility and mechanical properties, making it an ideal material for the manufacture of bioceramics, which is expected to be used in artificial bone, tooth repair and other fields, bringing new treatment options for patients, showing broad Application Prospects.

Company Profile

RBOSCHCO is a trusted global chemical material supplier & manufacturer with over 12 years of experience in providing super high-quality chemicals and Nanomaterials. The company exports to many countries, such as the USA, Canada, Europe, UAE, South Africa, Tanzania, Kenya, Egypt, Nigeria, Cameroon, Uganda, Turkey, Mexico, Azerbaijan, Belgium, Cyprus, Czech Republic, Brazil, Chile, Argentina, Dubai, Japan, Korea, Vietnam, Thailand, Malaysia, Indonesia, Australia, Germany, France, Italy, Portugal etc. As a leading nanotechnology development manufacturer, RBOSCHCO dominates the market. Our professional work team provides perfect solutions to help improve the efficiency of various industries, create value, and easily cope with various challenges. If you are interested, please send an email to sales1@rboschco.com

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5 FAQs of Aluminum Nitride Isostatic Ceramics

Q1: What is the difference between Aluminum Nitride isostatic ceramics and other ceramic materials (e.g. Alumina, Silicon Nitride)?

The core advantage of aluminum nitride (AlN) is its high thermal conductivity (170-320 W/(m・K)), which is 5-10 times higher than that of alumina (17-25 W/(m・K)), and its coefficient of thermal expansion (4.5-5.5×10-⁶/K), which is highly compatible with silicon-based chips, making it suitable for heat dissipation needs of high-power electronic devices. In contrast, silicon nitride (Si₃N₄) has higher mechanical strength (fracture toughness of about 5 MPa・m¹/²) but lower thermal conductivity (15-30 W/(m・K)), which makes it more suitable for aerospace components that require high reliability.

Q2: Why is there a wide range of thermal conductivity (170-320 W/(m・K)) for aluminum nitride?

The actual thermal conductivity is significantly affected by purity, the sintering process and impurities. The theoretical thermal conductivity of high purity AlN (≥99.9%) can be as high as 320 W/(m・K). However, the presence of oxygen impurities (e.g., Al₂O₃) or air holes in the production process can impede the phonon conduction, resulting in a decrease in thermal conductivity to 170-200 W/(m・K). For example, the addition of Y₂O₃ as a sintering aid can lower the sintering temperature, but an excessive amount will introduce a low-thermal conductivity grain boundary phase, and the amount of addition needs to be precisely controlled (usually ≤2 wt%).

Q3: What is the chemical stability of aluminum nitride ceramics?

Aluminum nitride is stable in neutral or weakly acidic environments but hydrolyzes in strong acids (e.g., hydrochloric acid with a concentration of >10%) or strong bases (e.g., NaOH solution), generating Al (OH)₃ and NH₃. At high temperatures (>1000°C), AlN can form stable interfaces with metallic aluminum liquids or molten silicon, so it is widely used in metallurgical crucibles and semiconductor growth equipment.

Q4: What are the advantages of isostatic pressing of aluminum nitride ceramics? How is it different from other molding methods (e.g., dry pressing, casting)?

The isostatic pressing process (Cold Isostatic Pressing CIP or Hot Isostatic Pressing HIP) provides a more uniform distribution of material density (deviation <1%) by applying pressure uniformly in all directions, allowing for the preparation of complex shapes (e.g., thin-walled, shaped structures) without the need for lubricants and with less contamination. In contrast, dry press molding is prone to delamination defects, cast molding is only suitable for sheet materials, and isostatic pressing can achieve a near-net shape, which is especially suitable for high-precision parts for aerospace.

Q5: How can we improve the densities and thermal conductivity of aluminum nitride ceramics?

Key measures include:Ultrafine powders: The use of nanoscale AlN powders (particle size <1 μm) can shorten the diffusion distance and promote sintering densification.

Low-temperature sintering technology: By adding rare earth oxides (e.g., Y₂O₃, La₂O₃) or fluorides (e.g., CaF₂), the sintering temperature can be lowered from 1800°C to 1600-1700°C while reducing the lattice oxygen content.

Hot Isostatic Pressing (HIP): Elimination of internal porosity at high temperature and high pressure, thermal conductivity can be increased to over 240 W/(m・K).