High quality, high thermal conductivity and high temperature resistant direct copper plated substrate

Overview of Direct Copper Plated Substrate

Direct Copper Plated Substrate is an advanced electronic packaging technology. It forms a high-quality conductive layer by directly plating a layer of copper on the surface of a ceramic, metal, or composite substrate. This technology has high electrical conductivity, low resistivity, and good thermal conductivity, which can effectively improve the thermal and electrical performance of electronic devices. At the same time, the direct copper plated substrate process is simple, relatively low cost, widely used in semiconductor packaging, electronic circuit manufacturing and other fields, for the development and production of high-performance electronic products to provide important support.

Features of Direct Copper Plated Substrate

Direct Copper Plated Substrate is a widely used technology in the field of electronic packaging, and its features are remarkable. Firstly, it has excellent conductivity; the copper layer has very low resistivity, which can effectively reduce the energy consumption of the circuit and improve the signal transmission efficiency. Secondly, its high thermal conductivity can quickly conduct heat and effectively solve the problem of heat accumulation in the working process of electronic devices.

In addition, the direct copper plating substrate adhesion is strong, the combination between the copper layer and the substrate is strong, not easy to peel off, even in high temperature, high humidity and other harsh environments, can maintain good performance. Process, direct copper plating technology is relatively simple, easy to operate, low cost, and easy to mass production.

Direct copper plating substrate also has good flatness and uniformity, which helps to improve the yield of subsequent processes, such as chip placement, soldering, and so on. Its environmental performance is also worthy of attention. With the development of technology, the copper plating process is constantly optimized to reduce the use of harmful substances and emissions. These features make the direct copper-plated substrate in the semiconductor packaging, electronic circuit manufacturing, optoelectronic devices and other fields widely used, for the high performance of electronic products and miniaturization provides an important support.

Specifications table of Direct Copper Plated Substrate

Parameter	Description	Typical Value/Range
Substrate Material	Base material for the substrate	Alumina (Al₂O₃), AlN, SiC
Substrate Thickness	Thickness of the base material	0.25 mm – 3.0 mm
Copper Layer Thickness	Thickness of the electroplated copper layer	10 µm – 100 µm
Copper Purity	Purity level of the copper used	≥ 99.9%
Surface Roughness	Roughness of the copper surface	Ra < 1 µm
Thermal Conductivity	Thermal conductivity of the substrate material	Al₂O₃: 20-30 W/m·K<br>AlN: 170-220 W/m·K
Electrical Resistivity	Resistivity of the copper layer	≤ 2.0 µΩ·cm
Adhesion Strength	Bond strength between copper layer and substrate	≥ 30 N/cm²
Operating Temperature	Temperature range for stable performance	-55°C to +150°C
Line Width/Spacing	Minimum achievable line width and spacing for circuit patterns	30 µm / 30 µm
Via Diameter	Diameter of through-vias for interconnects	50 µm – 120 µm
Surface Flatness	Planarity of the substrate surface	± 0.05 mm
Environmental Resistance	Resistance to moisture, chemicals, and oxidation	High (suitable for harsh environments)
Lead-Free Compatibility	Compliance with lead-free soldering processes	Yes
RoHS Compliance	Compliance with Restriction of Hazardous Substances directive	Yes

Applications of Direct Copper Plated Substrate

In the field of electronic packaging, it is one of the key materials for semiconductor chip packaging. The high conductivity and low resistivity of the copper layer can effectively reduce the power loss in the package and improve the speed and stability of signal transmission, while its good thermal conductivity helps to quickly dissipate heat and ensure the stable operation of the chip in a high-temperature environment. For example, direct copper-plated substrates are widely used in the packaging of high-performance computing chips and 5G communication chips to meet their high requirements for electrical performance and heat dissipation performance.

In the field of electronic circuit manufacturing, direct copper-plated substrates can be used to manufacture multilayer printed circuit boards (PCBs). The copper layer serves as a conductive line that enables the connection of complex circuits, and its high flatness and uniformity help to improve the manufacturing accuracy and reliability of PCBs.

In the field of new energy, the direct copper plating substrate also plays an important role. For example, in the power module package of electric vehicles, its high conductivity and heat dissipation performance can effectively improve the performance of the power module to meet the demand for high power density and high reliability of electric vehicles. In addition, in the manufacture of solar panels, direct copper-plated substrates can be used to make electrodes to improve the photoelectric conversion efficiency and stability of the panel.

In short, with its many advantages, direct copper-plated substrate in electronics, communications, new energy and other high-tech fields has shown great potential for the development of modern electronic technology to provide important support.

Company Profile

RBOSCHCO is a trusted global chemical material supplier & manufacturer with over 12 years of experience in providing super high-quality chemicals and Nanomaterials. The company exports to many countries, such as the USA, Canada, Europe, UAE, South Africa, Tanzania, Kenya, Egypt, Nigeria, Cameroon, Uganda, Turkey, Mexico, Azerbaijan, Belgium, Cyprus, Czech Republic, Brazil, Chile, Argentina, Dubai, Japan, Korea, Vietnam, Thailand, Malaysia, Indonesia, Australia, Germany, France, Italy, Portugal etc. As a leading nanotechnology development manufacturer, RBOSCHCO dominates the market. Our professional work team provides perfect solutions to help improve the efficiency of various industries, create value, and easily cope with various challenges. If you are interested, please send an email to sales1@rboschco.com

Payment Term

T/T, Western Union, Paypal, Credit Card etc.

Shipment Term

By air, by sea, by express, as customers request.

5 FAQs of Direct Copper Plated Substrate

Q1: What is the process flow of direct copper plating substrate?

The process flow of direct copper plating substrate (take DPC ceramic substrate as an example) is usually as follows: firstly, the ceramic substrate is pre-treated, such as cleaning, etc.; then the laser is used to prepare through holes on the ceramic substrate (aperture diameter is generally 60 μm-120 μm); then magnetron sputtering technology is used to deposit a metal seed layer on the surface of the ceramic substrate (Ti/Cu target); and then through photolithography and development to complete the production of line layer; After that, electroplating is used to fill the holes and thicken the metal line layer; finally, the surface treatment is used to improve the solderability and oxidation resistance of the substrate, remove the dry film and etch the seed layer to complete the preparation of the substrate.

Q2: What are the advantages and disadvantages of direct copper plating substrate compared with other ceramic metallization technologies, such as DBC and AMB?

Advantages: direct copper-plated substrate with high line accuracy, line width/line spacing as low as 30 μm – 50 μm, to meet the higher precision requirements of microelectronic device packaging needs; the use of laser drilling and plating to fill holes in the technology, ceramic substrate vertical interconnections between the upper and lower surfaces can be realized; low-temperature preparation process (300 ℃ or less) can be avoided to avoid high temperature on the substrate material and metal line layer.

Shortcomings: The metal line layer is prepared by electroplating process, which causes serious environmental pollution; the growth speed of electroplating is low, and the thickness of the line layer is limited; the bonding strength between the metal layer and ceramics is low, and the reliability of the product is relatively low when it is applied.

Q3: What are the application areas of direct copper plating substrate?

Direct copper plating substrate can be widely used in the high-power LED lighting field, such as automobile headlights, plant lighting, etc. Its high thermal conductivity, high line precision and high surface flatness can effectively solve the LED heat dissipation problem, reduce the size of the device, improve the integration of the package, and ensure the long-term stable operation of the LED. In the field of semiconductor lasers, as a substrate material, it can meet the needs of high-power semiconductor laser chip bonding, and its high thermal conductivity helps to improve heat dissipation ability and reduce thermal resistance, thus increasing the output power and extending the service life of the laser. In addition, it is also used in high-tech fields such as LIDAR, optical communication, power semiconductor packaging, and RF microwave device packaging.

Q4: Is the cost of direct copper-plated substrates high?

The production of direct copper-plated substrates involves multiple complex processes such as semiconductor microprocessing technology (e.g., sputtering coating, photolithography, developing, etc.) and printed wiring board preparation technology, which requires high requirements for material control and process technology integration, and thus makes its products relatively expensive.

Q5: What is the future development trend of direct copper-plated substrate technology?

In the future, direct copper plating substrate technology is expected to make breakthroughs in improving the bonding strength between the metal layer and the ceramic substrate, optimizing the plating process to reduce costs and improve production efficiency, and reducing environmental pollution. At the same time, with the development of electronic equipment in the direction of miniaturization, high performance and high integration, direct copper-plated substrate can play an important role in more emerging fields such as artificial intelligence, Internet of Things, 5G communications, new energy vehicles, etc., with a bright market outlook.