High Quality Precision Aluminum Nitride Ultra-thin Substrate

Overview of Aluminum Nitride Substrates

Aluminum nitride substrate is a top-notch electronic material. It features high thermal conductivity, which enables rapid heat dissipation, hence being a great fit for high-power electronic devices. Moreover, its fine electrical insulation property helps prevent circuit short – circuits. In addition, aluminum nitride substrate has the advantages of low dielectric constant and low expansion coefficient, which are well-matched with semiconductor materials. Commonly used in 5G communications, LED, power modules and other fields to help miniaturization of electronic equipment, high-performance development is an important basic material for the modern electronics industry.

Features of Aluminum Nitride Substrates

Aluminum nitride substrates have high thermal conductivity. They can effectively draw heat away from electronic components. This helps equipment stay at a steady temperature while working. In turn, this extends the life of the components and gives a performance boost. At the same time, aluminum nitride substrates also have good electrical insulation properties, which can effectively prevent current leakage and circuit short-circuit to ensure the safe operation of electronic equipment.

In addition, aluminum nitride substrates have a low dielectric constant, which helps to reduce losses during signal transmission and improve signal transmission quality. Its coefficient of thermal expansion is similar to that of semiconductor materials such as silicon, so it can be better matched with components such as chips, reducing stress problems caused by inconsistent thermal expansion and enhancing the stability of the overall structure.

These characteristics make Aluminum Nitride substrate highly favored in the field of electronic packaging, widely used in 5G communications, LED lighting, power electronics and many other high-tech fields for the development of modern electronic technology to provide important material support.

Specifications table of Aluminum Nitride Substrates

Parameter	Specification
Material	Aluminum Nitride (AlN)
Purity	≥99.5%
Thermal Conductivity	170-220 W/m·K (at room temperature)
Dielectric Constant	8.5-9.5 (at 1 MHz)
Dielectric Strength	>15 kV/mm
Volume Resistivity	>10^14 Ω·cm (at 25°C)
Coefficient of Thermal Expansion	4.5-5.0 ppm/°C
Surface Roughness	<0.5 µm (RMS)
Thickness	0.25-3.0 mm (customizable)
Size	Up to 150 mm × 150 mm (larger sizes available upon request)
Flatness	±0.1 mm (typical)
Parallelism	±0.05 mm (typical)
Edge Quality	Chamfered or rounded edges to prevent chipping
Surface Treatment	Polished, lapped, or etched surfaces available
Operating Temperature Range	-50°C to +300°C (continuous)
Applications	High-power LED lighting, RF & microwave devices, power electronics, thermal management systems

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Applications of Aluminum Nitride Substrates

Aluminum nitride substrate plays an important role in many high-tech fields with its excellent performance. In the field of electronic packaging, aluminum nitride substrates are widely used in the packaging of high-frequency and high-power integrated circuits, which can effectively solve the heat dissipation problem of chips and ensure the stability of circuits during high-load operation. In 5G communications, aluminum nitride substrates can be used for key components such as base station power amplifiers, where their low dielectric constant and high thermal conductivity help improve signal transmission efficiency and reduce power consumption.

In the LED lighting industry, Aluminum Nitride substrate as a heat dissipation substrate can significantly improve the heat dissipation performance of LED lamps and lanterns, prolonging their service life while maintaining good optical performance. In addition, aluminum nitride substrates are also used in the field of automotive electronics, such as power module packaging for electric vehicles, to provide reliable heat dissipation and insulation for high-voltage, high-current electronic components.

In the field of aerospace, the lightweight, high strength, and high-temperature characteristics of aluminum nitride substrate make it an ideal electronic material that can be used for satellites, electronic control systems of aircraft, and so on. Aluminum nitride substrate, with its unique properties, is now a key material for modern electronics. It supports the growth and innovation of many industries.

Company Profile

RBOSCHCO is a trusted global chemical material supplier & manufacturer with over 12 years of experience in providing super high-quality chemicals and Nanomaterials. The company exports to many countries, such as the USA, Canada, Europe, UAE, South Africa, Tanzania, Kenya, Egypt, Nigeria, Cameroon, Uganda, Turkey, Mexico, Azerbaijan, Belgium, Cyprus, Czech Republic, Brazil, Chile, Argentina, Dubai, Japan, Korea, Vietnam, Thailand, Malaysia, Indonesia, Australia, Germany, France, Italy, Portugal etc. As a leading nanotechnology development manufacturer, RBOSCHCO dominates the market. Our professional work team provides perfect solutions to help improve the efficiency of various industries, create value, and easily cope with various challenges. If you are interested, please send an email to sales1@rboschco.com

Payment Term

T/T, Western Union, Paypal, Credit Card etc.

Shipment Term

By air, by sea, by express, as customers request.

5 FAQs of Aluminum Nitride Substrates

Q1:What are the production processes for Aluminum Nitride substrates?

The common fabrication processes include casting, direct copper bonding (DBC), active metal brazing (AMB), thick film printing (TPT), electrodeposition copper (EDC), chemical copper plating (CDC), direct copper plating (DPC), etc. The DBC process can realize high-temperature sintering between copper foil and ceramics; the AMB process adds active metal between copper foil and ceramics to make a thin film. The casting method is suitable for large-scale production and can be made into thin films; the DBC process can realize high-temperature sintering of copper and ceramics, and the AMB process adds active metal brazing between copper foil and ceramics.

Q2:Can Aluminum Nitride substrates be made into multilayer boards?

Aluminum nitride substrates can be made into multilayer boards, but the technical difficulty is relatively large, and special processes such as LTCC (low-temperature co-sintering technology) or HTCC (high-temperature co-sintering technology) are required.

Q3:What are the main applications of Aluminum Nitride substrates?

Aluminum nitride substrates are widely used in 5G communication, LED lighting, power electronics, automotive, electronics, aerospace, military defense and other fields. For example, it is used in 5G base stations for power amplifiers and other key components, as a heat dissipation substrate in LED lighting, and for power module packaging in electric vehicles.

Q4:Is the cost of Aluminum Nitride substrate high?

Compared to other ceramic materials, the manufacturing cost of aluminum nitride is at the same level and is usually cheaper than silicon nitride. Although the price is affected by a variety of factors such as manufacturing process, material size, packaging, and impurity content, it is cost-effective in many high-performance application scenarios due to its excellent performance, which provides more reliable operation of equipment.

Q5:What are the dimensions of Aluminum Nitride substrates?

Generally, the maximum size is about 110mm x 140mm. The size is relatively small, and it is difficult to do like FR4 board for a very long time; this is because aluminum nitride substrate is more brittle, easy to break, and the size is too large and does not meet the nature of its substrate characteristics.