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Home
About Us
News
Company News
Industry News
Products
Inorganic Compound Powder
Elementary
Boride Powder
Carbide powder
Nitride Powder
Oxide Powder
Silicide Powder
Sulfide Powder
Advanced Ceramics and Special Materials
Advanced Ceramic
MAX Phase
Organic Chemicals and Additives
Concrete Admixture
Stearic Acid Series
Surfactant
Thermal Insulation and Nanotechnology
Aerogel Insulation
Nanoparticles
Metals and Alloys
Cladding of Metals
Metal 3D Printing
Metallic copper
Metal Alloy
Battery Materials
Anode Material
Cathode Materials
Other Material
Blog
Contact Us
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Direct bonding to copper substrates
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Direct bonding to copper substrates
Advanced Ceramic
High thermal conductivity customizable for direct bonding to copper substrates
Tel: +86-379-64280201
Email: tech@nanotrun.com
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