Customized industrialized high quality metallized ceramic insulators

Overview of Metallized ceramic insulators

Metallized ceramic insulators are composite insulating materials combining metal and ceramics through a specific process. Both ceramic high insulation, high temperature resistance, corrosion resistance and metal conductivity, weldability, thermal expansion coefficient of good match. Metallized ceramic insulators are often processed by surface metallization (such as the Mo-Mn method), so that the ceramic and metal are connected through brazing and other reliable connections. Metallized ceramic insulators are widely used in electronic packaging, aerospace, power electronics and other fields, such as power device packaging, vacuum electronic device electrode connection, etc., to ensure high reliability and stability of equipment.

Features of Metallized ceramic insulators

Excellent electrical insulation properties, the ceramic matrix itself has a very high resistivity and dielectric strength, can be in the high-voltage, strong electric field environment to effectively block the current leakage, to ensure the reliability of the insulation of the device, this characteristic makes it in the power electronics, precision instruments and other insulation requirements of the field of the strict requirements of the indispensable. Secondly, the thermal performance is outstanding, the high temperature resistance of ceramics gives the material in a high temperature environment (such as hundreds of degrees Celsius) the ability to work stably, and at the same time, through the rational design of the metallization layer, the overall coefficient of thermal expansion can be adjusted, so that it matches with the semiconductor chip, the metal shell and other peripheral materials, to avoid stress cracking due to thermal mismatch, to ensure that the device in the structural stability of the environment of the cycle of high and low temperatures.

Metallized ceramic insulator mechanical strength and reliability, the high hardness and compressive strength of ceramics to provide solid support for the device, while the metallization layer not only enhances the interfacial bonding force, but also gives the material weldability and processability, easy to brazing, sintering, and other processes and other metal parts connected to the formation of a complete electronic packaging structure.

Metallized ceramic insulators have excellent chemical stability; the ceramic matrix is resistant to acid and alkali corrosion, molten metal erosion, and suitable for use in harsh chemical environments. The metallization layer through surface treatment (such as plating to protect) can also resist environmental erosion and extend the service life of the device.

Metallized ceramic insulators are highly flexible in design, with ceramic types (e.g., alumina, aluminum nitride, etc.) and metal systems (e.g., copper, molybdenum, tungsten, etc.) available for different applications. By adjusting the thickness of the metallization layer, the composition, and the process parameters, we can accurately regulate the electrical, thermal, and mechanical properties of the materials and satisfy a variety of engineering application scenarios.

Specifications table of Metallized ceramic insulators

Property	Value
Purity	≥95%
Volume Density	≥3.6 g/cm³
Water Absorption	0%
Thermal Conductivity (25℃)	22.4 W/m·K
Coefficient of Thermal Expansion (20 – 1000℃)	8.2×10⁻⁶/℃
Flexural Strength	340 MPa
Compressive Strength	2103 MPa
Tensile Strength	193 MPa
Hardness (Rockwell 45N)	78
Withstand Voltage	8.3 kV/mm
Dielectric Constant (1 MHz)	9.1
Dielectric Loss Angle (1 MHz)	0.0004
Volume Resistivity (25℃)	1×10¹⁴ Ω·cm 4×10⁹ Ω·cm (500℃) 5×10⁵ Ω·cm (1000℃)

Applications of Metallized ceramic insulators

Metallized ceramic insulators are the core material for power semiconductor devices in the field of electronic packaging, such as IGBT (Insulated Gate Bipolar Transistor) and MOSFET (Metal-Oxide Semiconductor Field-Effect Transistor). The high insulating properties of ceramics isolate the high-voltage circuits, and at the same time, the metallized layer realizes a reliable electrical connection between the chip and the external pins, and the excellent heat conduction can also export the heat generated during the operation of the chip quickly, so that the chip can be used for a variety of engineering applications. Its excellent thermal conductivity can also quickly export the heat generated when the chip is working, improving the power density and reliability of the device.

In the aerospace and defense field, metallized ceramic insulators are used in the manufacture of high-temperature sensors in aircraft, radar modules and satellite communications equipment, which can withstand extreme temperature changes (e.g., -200 ℃ to +500 ℃) and strong vibration, but also in the high-vacuum, radiation and other harsh environments to maintain stable insulation and conductivity, to ensure that avionics equipment in the normal operation of the complex operating conditions.

In energy and power systems, metallized ceramic insulators are important components of high-voltage power transmission and distribution equipment, new energy vehicle charging piles and nuclear fusion devices, for example, in gas-insulated switchgear (GIS), it serves as an insulating support and conductive connectors, which can withstand tens of thousands of volts of high-voltage and high-current impacts, and at the same time, resist the corrosion of SF₆ gases, to ensure the safe and stable operation of the power system. Operation of the power system.

In the field of advanced manufacturing and precision instruments, metallized ceramic insulators are used in photolithography, electron beam welding machine and other precision equipment, vacuum chamber sealing and electrode lead, low outgassing rate of ceramic and metallized layer of high airtightness to ensure the stability of the vacuum environment, and high-precision dimensional control and surface flatness to meet the needs of the nanoscale manufacturing process.

In addition, in the field of medical electronics, metallized ceramic insulators are used in the high-voltage power supply modules of high-end imaging equipment (e.g., CT, MRI) to ensure the safety and imaging accuracy of the equipment in long-term use by virtue of their radiation resistance and long life. From industry to cutting-edge technology, metallized ceramic insulators continue to promote breakthroughs in the performance of core devices in various fields through material and process innovation.

Company Profile

RBOSCHCO is a trusted global chemical material supplier & manufacturer with over 12 years of experience in providing super high-quality chemicals and Nanomaterials. The company exports to many countries, such as the USA, Canada, Europe, UAE, South Africa, Tanzania, Kenya, Egypt, Nigeria, Cameroon, Uganda, Turkey, Mexico, Azerbaijan, Belgium, Cyprus, Czech Republic, Brazil, Chile, Argentina, Dubai, Japan, Korea, Vietnam, Thailand, Malaysia, Indonesia, Australia, Germany, France, Italy, Portugal etc. As a leading nanotechnology development manufacturer, RBOSCHCO dominates the market. Our professional work team provides perfect solutions to help improve the efficiency of various industries, create value, and easily cope with various challenges. If you are interested, please send an email to sales1@rboschco.com

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By air, by sea, by express, as customers request.

5 FAQs of Metallized ceramic insulators

Q1: How are the insulating properties of metallized ceramic insulators ensured?

Ceramics themselves are good insulating materials with high resistivity and dielectric strength. Metallized ceramic insulators further improve the insulating properties of the ceramic matrix by optimizing the formulation of the ceramic material, increasing the sintering temperature, and reducing grain boundaries. At the same time, the good bonding between the metallized layer and the ceramic avoids leakage due to interfacial defects.

Q2: How is the coefficient of thermal expansion of metallized ceramic insulators matched with other materials?

Ceramic and metal materials with similar coefficients of thermal expansion are selected according to specific application requirements. For example, for applications connected to silicon chips, ceramic materials with coefficients of thermal expansion close to that of silicon, such as aluminum nitride ceramics, can be selected and matched with suitable metallization layer materials, such as molybdenum and tungsten, whose coefficients of thermal expansion are also matched to ceramics and silicon. In addition, the overall thermal expansion properties can be fine-tuned by adjusting the thickness, composition and process parameters of the metallization layer.

Q3: What are the common metallization processes used for metallized ceramic insulators?

The common ones are Mo – Mn method, which is based on refractory metal powder Mo, adding a small amount of low melting point Mn, and then adding binder to coat the ceramic surface and form the metallized layer by sintering; and active metal brazing method, which has fewer process steps and forms a good bond between ceramics and metal through active metal; Direct Bonded Copper (DBC) method, which utilizes the direct bonding of copper and ceramics at high temperatures to achieve metallization; and the magnetron sputtering method, in which metal atoms are deposited on the ceramic surface by magnetron sputtering in a vacuum environment to form a metallization layer.

Q4: How to ensure the bonding strength of the metal to the ceramic during the metallization process?

First of all, the ceramic surface should be strictly cleaned and pre-treated to remove impurities, improve the surface roughness and increase the contact area between metal and ceramic. It is also critical to choose the right metallization process and material, such as in the active metal brazing method, where the active metal can react chemically with the ceramic surface to form a strong chemical bond. In addition, controlling the process parameters, such as temperature, time, and atmosphere, as well as performing the necessary post-treatments, such as annealing, can help to improve the bonding strength between the metal and the ceramic.

Q5: What are the specific applications of metallized ceramic insulators in power electronics?

It is widely used in the packaging of power semiconductor devices such as insulated gate bipolar transistors (IGBTs) and metal-oxide semiconductor field effect transistors (MOSFETs). It serves as an insulating support and conductive connector, isolating high-voltage circuits through the high insulation of ceramics, and utilizing the metallization layer to achieve a reliable electrical connection between the chip and the external pins, while its good thermal conductivity also allows for the rapid export of heat generated when the chip is in operation.